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Jan 6-9, 2026

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Wi-R Silicon Chips

Compare our Wi-R silicon chips and discover the right solution for your next-generation wearable, IoT, or secure connectivity product.
Chip
Type
Status
Speed
Power
Range

YR23

Body Area Network chip for ultra-low power, secure wearable connectivity.

  • Charging-free health wearables
  • 20 hour battery-life earbud
Wi-R BAN
In Production
Up to 5 Mbit/s
1 mW
Up to 15 m along the surface, with off-surface leakage confined to 0.1 m.

YR31

Higher-speed Wi-R BAN chip for room-scale, low-latency body and near-surface connectivity.

  • All-day AR video streaming
  • Low-latency lossless audio
Wi-R BAN
Sampling
Up to 20 Mbit/s
< 6 mW
Up to 15 m along surfaces with ~0.5 m off-body coverage

XA-NFE2001

Near-Field Electric chip for secure, touch-to-near-range wireless connectivity.

  • Fistbump to transfer data
  • Touch-to-unlock/pay
Wi-R NFE
In Production
Up to 5 Mbit/s
< 1 mW
Configurable 5–25 cm range; up to 1 m between devices at lower data rates.

XA-NFE3001

High-speed near-field data link.

  • High speed data offload for BCI
  • Firmware provisioning
Wi-R NFE
In Testing
Up to 30 Mbit/s
< 6 mW
Up to 1 m from the device

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