Ixana Unveils YR11 Worlds First Wi-R Silicon Chip
MENAFN reports Ixana announced YR11, the world's first high-speed Wi-R silicon chip ready for customer sampling at CES 2023, enabling smart devices to securely communicate with touch through AR headsets and wearables.
MENAFN reports Ixana announced YR11, the worlds first high-speed Wi-R silicon chip ready for customer sampling at CES 2023 booth 61305. The chip enables smart devices to securely communicate with touch, demonstrated through AR headsets and wearables.
Key Wi-R capabilities showcased
Video demonstration highlights streaming video all day to ultra-light AR headsets, secure touch pairing for mobile smartwatch wearables, pairing-free wireless headphones, real-time AI asset tracking alerts, and fist bump contact file exchange.
Evaluation kit availability
YR11 Evaluation Kit now available for pre-order with USB-C smartphone plugin supporting 1Mbit/s distributed computing. Higher speed chips up to 20Mbit/s for music video streaming, AR and Metaverse applications under development.
Technology advantages
Based on seven years Purdue University research, Wi-R offers 100x better energy efficiency than Bluetooth with faster data rates, lower latency, higher reliability, physical security, multi-node coexistence and touch detection through body surface confinement.
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