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Ixana Raises 3M with Wearable Silicon Chip Breakthrough

Nov 18, 2022Evertiq
1 min read

Evertiq reports Ixana raised $3M backed by leading investors to develop high-speed human-computer interfaces, targeting wearable hardware limitations preventing all-day AR headset usage.

Wi-R NFE chip and applications

Evertiq reports Ixana raised 3 million dollars backed by Uncorrelated Ventures, Samsung Next, Evonexus, Paradigm Shift and Hack VC to develop high-speed human-computer interfaces. The funding targets wearable hardware limitations preventing all-day AR headset usage.

Solving AR thermal and battery challenges

Billions invested in AR headsets face technical hurdles like thermal budget and battery drain. Ixanas breakthrough silicon chip enables wire-free distributed computing, allowing low-power AR headsets to last full day on single charge with always-on front-facing cameras.

Expert leadership team

Co-founded by chip experts Shreyas Sen (CTO, Purdue Chair Associate Professor), Shovan Maity (Head of Research) and Angik Sarkar (CEO). The 15+ member team includes alumni from Intel, Qualcomm, Silicon Labs and Texas Instruments, currently testing developer evaluation hardware for early 2023 shipment.

Path to all-day wearable AR

The investment accelerates commercialization of Ixanas Wi-R technology enabling real-time visual analysis and feedback through lightweight wearables. Developer kits provide path for AR ecosystem partners to integrate the body-area networking solution.

FundingSilicon ChipWearablesAR HeadsetsHuman Computer Interface

Evertiq

Evertiq covers electronics design, components and technology innovations.